Circuit Pak offers state-of-the-art surface mount equipment.  Combined with a staff that is dedicated to producing quality products, you'll find that we can quickly produce any assembly that you desire, in any quantity you need, and in time to meet your requirements.

• 5 high speed SMD lines producing at 60,000 part placements per hour
• Surface mount assembly equipment can accommodate component sizes from 0102s through a maximum package size of 74 mm. square at accuracies to +/- 0.025 mm.
  
• Fine pitch placement to 0.15 mm.
• BGA’s and micro-BGA’s are accurately placed using the high-resolution gray scale vision processing system.
  
• RoHS
• POP Assembly(Part on Part Assembly)
• Our reflow system incorporates a total forced convection reflow oven. This allows greater equilibrium to reflow and reduces the likelihood of overheating, which can thermally stress the components and printed circuit boards. Temperature gradients across boards packed with both large and small components are minimized.
• Our laser section microscope permits non-contact dimensional measurements of solder paste deposition. It can quickly identify a variety of solder paste defects, which together account for over 90% of all assembly defects. This gives us even tighter control over the quality of the printed circuit boards we assemble.